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News & Views

Come and visit our booth at the SPIE Advanced Lithography conference in San Jose, CA, on Feb 23-24 - and see our latest applications of MedeA® in the field of lithography and semiconductor manufacturing (one of the examples modeling pattern collapse issues is below).

Paul Saxe and Jason Coloma will be there throughout the conference, so look us up for a discussion!

MedeA 2.19 provides a range of enhancements and new capabilities in the MedeA® environment.

Join Materials Design team at IEDM in Washington, DC on Dec 7-8!

Together with Global TCAD Solutions, we will present a paper at IEDM on December 7 at 1:30pm (in Georgetown room) on an integrative approach to device modeling on Monday at 1:30pm.

Materials Design, Inc. is excited to launch a new part of our portfolio built on MedeA®.

Get the essential property data for your materials – reliably, economically and saving your valuable time.

Whether you are looking to better guide your experimental work, obtain the data which is difficult or costly experimentally, or running a screening series – we can help getting you the answers you need. All based on MedeA®.

Join Us At IEDM and Our Special Event: Integrative Approach To Semiconductor Device Modeling

Materials Design, Inc. and Global TCAD Solutions invite you to join us in Washington, DC on December 7 and 8 for a unique experience – combining the best-in-class TCAD and atomistic simulation tools to create an integrated device modeling framework.

Atomistic simulations based on forcefields allow you to simulate systems with many thousands of atoms over millions of configurations, thus reaching beyond today's computing capacity of ab initio calculations. However, the fidelity of forcefield-based simulations is determined by the reliability of the forcefield employed.

Materials Design S.A.R.L. and The Interdisciplinary Center For Mathematical And Computational Modeling (ICM) At The University Of Warsaw are delighted to invite you for a joint workshop.

November 5, 2015 - ICM, Warsaw University

Warsaw, Poland

The workshop will let you experience the latest developments in computational materials engineering, including practical examples of how these methods help solve industrial and academic research needs.

Next week will be busy for us - but gives you a chance to meet our team on both continents. So in addition to our earlier invitation to Semicon Europa, we invite you to visit our booth #411 at Materials Science & Technology 2015 event in Columbus, Ohio, October 4-8. You will have the chance to speak directly with Paul Saxe, CEO and Founder, and experience the capabilities of MedeA® at first hand.

When we started Materials Design, Inc. in 1998 our dream and goal was to make MedeA® the most comprehensive modeling platform for atomistic simulations. With our latest release, which we have just announced, we have reached that goal.

Visit us at this leading trade show for semiconductor industry in Europe – we will be at the booth 1004, right next to TechArena 1 where many conference events take place.

For free entrance to the exhibit, please register using our promotional code MedeA.

We will be pleased to speak with you also at our company presentation on Wed, Oct 7, at 15:30-15:45, in TechLounge.

News & Views

May 2-4th Free Registration Here!

Click here to see 2.21 new capabilities

Software Platforms for Electronic/Atomistic/Mesoscopic Modeling: Status and Perspectives

Chief Scientific Officer Dr. Erich Wimmer joins Senior Scientist Dr. Volker Eyert at the EMMC International Workshop in Vienna on ...

Sales Executive, Eastern USA - Materials Design, Inc. is leading the way in developing software to simulate materials at the atomistic-level, and proud to provide top-notch scientific support to our customers who are applying these capabilities.

organized by DECHEMA in Frankfurt, Germany, March 9-10, 2017