Shanghai, China – March 24, 2025 – Materials Design's Dr. Xiaoli Liu, an expert in materials simulation, is set to showcase her insights at the prestigious CSTIC 2025 conference, taking place from March 24th to 25th in Shanghai. Hosted by IEEE in collaboration with SEMI, the conference is the largest semiconductor gathering in China, drawing industry leaders, researchers, and innovators from around the globe.
Dr. Liu’s presentation, titled “Advancing the Semiconductor Industry Through Multiscale Materials Simulation – A Materials Design Perspective,” will delve into the cutting-edge role of materials simulation in driving advancements within the semiconductor field. The work described by Dr. Liu highlights the importance of multiscale approaches to enhance the design and performance of semiconductor materials, offering potential solutions to some of the industry's most pressing challenges.
This year, Tri-I is proudly participating as a sponsor of the conference, with a booth showcasing the latest in semiconductor technology and research. In addition to their sponsorship, Tri-I serves as the distributor of Materials Design's MedeA software in China, bringing advanced simulation capabilities to local markets. Their partnership with Materials Design reflects the growing importance of simulation in the development of next-generation semiconductor materials.
The CSTIC 2025 conference provides an essential platform for discussions on the future of semiconductor innovation, with experts like Dr. Liu leading the way in bridging research and real-world applications.
For more information about the event, including session schedules, visit the official CSTIC 2025 website.
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